Aluminum PCB Manufacturing Process
Have you ever visited an aluminum printed circuit board fabrication process? If yes, did you find that it is different from conventional PCB manufacturing process? If no, it is ok. In this article, EPCB will talk about the unique PCB manufacturing process.
The biggest difference from conventional PCB manufacturing process is the chemical milling step. Though both aluminum PCB boards and most multilayer PCB boards need CNC milling, the unique of aluminum PCB process is listed as follows:
Thickness Parameter: Since aluminum PCB board use chemical milling method, the most thin begins with 30 μm. It is known to all that thicker aluminum PCB boards are mostly used ultra-thin sheets of 30 μm aluminum foil. Sometimes, a 5μm film of copper will be added required by customers, or to improve the solderability, or you can add both.
Stuck-Up: In most cases, the stack-up of aluminum PCB board is simple, but if your customer require some unique one, for example with specific configurations, then it will become relatively complex.
Fine-Line: The final aluminum PCB is a circuit board with fine-line aluminum traces. Often, the width of aluminum trace is wider than that on conventional PCB boards.