Eight-Layer PCB Stackup

Dated:2018-03-12      Popularity:922


PCB Board

The PCB stackup arrangement is the basis of the entire PCB design system. Any deficiencies in the stackup design will ultimately affect the overall EMC performance.

In general, EPCB thinks that the design of the PCB stackup mainly comply with two rules:

a.Each alignment must have an adjacent reference layer (power or ground);

b.Keep the minimum spacing between adjacent main power and ground so as to provide a larger coupling capacitance.

Eight-layer PCB board usually uses the following three kinds of stackup:

1.This is not a good PCB stackup way due to poor electromagnetic absorption and large power supply impedance. Its structure is as follows:

L1-Signal 1-component surface, microstrip wiring layer;

L2-Signal 2-internal microstrip wiring layer, preferably the wiring layer is X direction;

L3-Ground;

L4-Signal 3-stripline wiring layer, preferably the wiring layer is Y direction;

L5-Signal 4-stripline wiring layer;

L6-Power;

L7-Signal 5-internal microstrip wiring layer;

L8-Signal 6-microstrip wiring layer.

2.Due to the increase of reference layer, this kind of PCB stackup method has better EMI performance, and the characteristic impedance of each signal layer can be well controlled. Its structure is as follows:

L1-Signal 1-component surface, microstrip alignment layer;

L2-Ground-better electromagnetic wave absorption capability;

L3-Signal 2-stripline wiring layer;

L4-Power-together with the ground floor below can well absorb electromagnetic;

L5-Ground;

L6-Signal 3-stripline wiring layer;

L7-Power-has a larger power supply impedance;

L8-Signal 4-microstrip wiring layer.

3.The best PCB stackup way thanks to the use of multiple reference plane which has a very good geomagnetic absorptive capacity. Its structure is as follows:

L1-Signal 1-component surface, microstrip wiring layer;

L2-Ground-better electromagnetic wave absorption capability;

L3-Signal 2-stripline wiring layer;

L4-Power-together with the ground floor below can well absorb electromagnetic;

L5-Ground;

L6-Signal 3-stripline wiring layer;

L7-Ground-better electromagnetic wave absorption capability;

L8-Signal 4-microstrip wiring layer.

You can choose the PCB stackup design method according to the number of signal networks, device density, PIN density, signal frequency, board size, etc. The greater the number of signal networks, the greater the device density, the greater the PIN density, and the higher the signal, therefore, you should design a multilayer board. Besides, for good EMI performance, it is best to ensure that each signal layer has its own reference layer.


PCB Stackup Design  

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