PCB Blind Via
Complex and industrial printed circuit boards usually have more than one layer of copper traces, and they are usually made by pressing. Through-holes require the necessary connections between the layers and the electronics. Three types of vias are used when designing multilayer printed circuit boards, namely, buried vias, blind vias, and vias. Through-hole The through-hole is used to connect the two outermost layers together. On the other hand, the buried vias connect the two intermediate layers. PCB blind via is a printed circuit board in which via-holes connect the outermost and inner layers of the component.
PCB blind holes are also used to bond the layers together. In order to create a blind hole or a buried hole in a PCB, a designer must consider many factors such as the weight of the copper, the thickness of the designed board, the number of surface mount components, the number of layers, and the access. A pad is usually formed around the blind via. The smallest hole size is about 0.45 mm.
Because of laser drilling technology can help PCB blind via production by controlling the depth of the hole. Some manufacturers limit via connections to even layers from the top surface and they also do not allow blind vias from the bottom, which is the standard practice in the manufacturing industry. In addition to laser drilling, the burying through the PCB and through the printed circuit board is made in advance by mechanical drilling. The manufacturer provides the aspect ratio between the via diameter and the via pad, indicating his ability to make the PCB through the via. Therefore, designers and manufacturers must pay attention to the depth of the multi-layer PCB-related settings.