PCB Board Structure
PCB boards promote the development of electronic products. From wire contacts to modern multilayer PCBs, they made electronic compact and realized user interaction. A typical PCB connects the electronic components by mounting them on board surface. The PCB structure varies based on PCB types available in the market.
A basic PCB structure contains a strong insulating material, using a dielectric as a substrate and a resin-based adhesive to bond the embedded copper layer. Multilayer PCB boards are created by repeated stacking of the two materials together with connecting links in between them.
Copper used in the PCB has a variety of thickness. Commercially, the copper layer is available from 0.009mm to 0.38mm and inner layer from 0.01mm to 0.20mm.
However, the copper thickness is not limited to the commercial standards with a dielectric substrate to insulate them.
PCB assembly must have a physical strength to keep the components in place and avoid stress-related problems. FR-4 is mainly used for the production of PCB substrate or core. Because it is sandwiched by resin-bonded fiberglass, therefore it has a high physical strength and a little flexibility to extend the service life of the system.
In order to choose an appropriate PCB structure for the given requirement, one must have the details of the key parameters. The number and density of PCB components mainly determines the PCB structure as single or multilayer. Power handling capacity determines the thickness and trace width of the copper layer on the PCB.