PCB Design Guidelines
In this article, EPCB outline basic PCB design guidelines which can reduce your board cost and minimize the risk of errors arising during manufacture. High power boards have different rules especially in terms of spacing, traces size and power isolation.
1.Use a GND symbol for all the GND connections.
2.Use power symbols for all VCC.
3.Add color notes to differentiate a complex design from various smaller bits.
1.All footprints need silkscreen indicators showing mechanical sizes, dimensions, or anything unique about the part.
2.Top component layer should be marked by a red center cross.
3.Package outline layers should outline the actual package size.
1.Create your board frame on a 0.05 grid. Make sure the lower left corner is at 0,0.
2.Stick parts on a 0.05 grid.
3.Any LED connectors, pins, switches should be labeled with its purpose and data.
4.It is better to avoid vias to go through the silkscreen when adding labels.
5.Minimum size of annular ring and trace should be 7mil, while minimum drill size should be 15mil.
6.It is better to leave 7mil space between traces and space.
7.Avoid 90 degree corners. Straight lines with 45 degree corners are preferred.
8.To prevent pours from shorting to traces make sure you use a 10mil isolation setting on any of the ground pour.