PCB Heat Dissipation Design
When working, PCB board will produce a certain amount of heat which can cause inner temperature sharply increased. If the heat fails to dissipate at once, the high temperature inside will decrease the board reliability. Therefore, the good board heat dissipation is really important, so EPCB here recommends some useful tips to you.
Components on a printed circuit board should be arranged in the order of calorific value and the degree of heat dissipation. Components featuring poor heat resistance or low calorific value like small signal transistors, small scale integrated circuits, electrolytic capacitors, etc. should be placed on the upper of the cooling air flow, while components featuring good heat resistance or high calorific value like power transistors, big scale integrated circuits etc. should be placed on the downstream of the cooling air flow.
In the horizontal direction, high-power components are placed as close as possible to the printed circuit board edge so that the heat transfer path can be shortened. In the vertical direction, high-power components are placed as close as possible to the top printed circuit board to reduce the impact other components.
Temperature-sensitive components should be placed on the lowest temperature zone like the board’s bottom. Never place them directly above heating components, and multiple components should be placed on the horizontal level.