PCB Material Classification
Printed circuit boards can be divided into the following three categories:
Metal foil substrate printed circuit board is put on the rigid plastic substrate, covered with a thickness of 0.05mm copper foil. Put tin-plated alloy or silver on the surface of copper foil to improve the resistance of soldering performance. Put some gold-plating on the plug surface to improve abrasion resistance and electrical conductivity.
Use electrified copper which has good conductivity can make wire and components. Attached the metal foil on the surface of the plastic film or sandwiched between two layers of plastic film can make flexible printed circuit. The preferred film used is PET, followed by PP, F4 and PI film. The advantages of such printed circuit boards are soft and deformable. Thick film printed circuit board is made by pouring a layer of low-conductivity layer in the ceramic substrate.
With the rapid development of electronic products to miniaturization, multi-functionalization, high performance and high reliability, multi-layer printed circuit boards at home and abroad are moving towards high precision, high density, high performance, micro voiding, thinning and multilayered. In the case of high density, line pitch on a printed circuit board is narrowed to 0.4 mm or even less; and up to seven layers of PCB boards have been developed in terms of multilayer.
Manufacturing a multi-layer printed circuit board uses a thin core copper cladding as its base, and makes it into a conductive graphics circuit, and alternately overlap with the semi-cured film. Laminated together, and form interconnection between three or more graphics circuit layers.