PCB Quality Control during Assembly
To make sure PCBA run well, the assembly process must consider the tolerances of both the board and components. Also, a properly designed PCBA is a good basic to improve quality, reduce manufacturing time and lower product cost. In this post, we list several points for your reference to control PCB quality during assembly.
Assembly documentation should clearly specify the solder type tin-lead or RoHS and flux required (clean vs. no-clean).
Components should be placed 6.35 mm from the PCB edge. With regard to potential damage during depenalization, parallel to the edge is better.
Component spacing is critical, particularly around ball grid assemblies (BGAs)—150" spacing is recommended. This spacing allows enough room for hot air rework tools if upgrades or replacement is required.
Delicate components, such as ceramic capacitors, are at risk of cracking when they are placed too close to the edge. Manufacturing equipment clamping mechanisms require un-obstructed room to grab the PCB effectively.
Identify product labelling and traceability requirements on assembly documentation. The label location should be identified with a box in the silkscreen layer.
IPC-A-610 is accepted worldwide as a standard for high-quality, high-reliability PCBA assemblies.
Maximize automation and minimize hand assembly to lower cost.
Hope it is useful to you.