PCB Trace Design
Optimizing PCB design to meet industry standards reserves a huge place in ensuring efficiency and longevity of system. One of the major design aspects of PCB optimization is power loss. In order to significantly reduce power loss, tracking optimization plays a key role.
A power system typically requires wider PCB traces than logical systems to meet the output power requirements. Before designing, you must know that the chart contains the current capacity of the PCB in various widths. The most common PCB clad contains 1 oz copper so the Ampere vs. Width per 10°C would be shown as follows
Power surges are common in power electronics design, so in some cases, due to load change of inductor collapse the lead may overload if the PCB trace has been designed only to the limits the line may be shorted. This may even lead to a chain reaction and damage to the components on board.
To further increase the current capacity, the screen printing plate can be pre-coated before etching, and coated with thick solder layer by increasing the area to increase the current carrying capacity. Solder has a higher resistance than copper, so the volume of the solder dump must be high to compensate for the resistance.
One of the major loss/interference factors apart from resistance power loss is mutual induction. High frequency components with high current flow can produce detectable amount of power transfer. This in turn can cause interference to the system or cause loss of power through radiation.