Printed Circuit Board Manufacturing Process
In this article, EPCB would like to discuss different types of industrial PCB manufacturing process.
The single-type PCB manufacturing process produces a rigid laminated single-sided PCB consisting of a braided glass epoxy-based material coated with copper. Copper thickness varies. The double-sided PCB manufacturing process is a method applying copper on both sides of a substrate.
The multilayer PCB manufacturing process is a technique in which the same base material as the copper foil is used on the top, the bottom, and between layers. The thickness of the core varies from 0.038 inches to 0.005 inches, depending on the design of the PCB manufacturing. The copper foil used in the PCB manufacturing process has a thickness of 1 square inch and a thickness of 1.34 mils.
The number of steps involved in the PCB manufacturing process is discussed below.
Prepreg pastes glue to bind the layers together.
The PCB manufacturing process requires that the drilling is usually 5 mils larger than the finished board.
Deburring is a mechanical process used to remove the edges created during the drilling time of the PCB manufacturing.
Electroless copper deposition is sometimes used to deposit copper layers between 45 and 60 millionth of an inch. A layer of copper is chemically deposited on the surface of the panel.
A dry film resist coating is used on the outer surface including the drilled hole as a photosensitive film.
The copper pattern board is applied to the PCB surface with a thickness within 1mm, depending on the final product of the PCB manufacturing process.
Tin plating is used to maintain the copper traces, pad and hole walls during the outer layer etching process.
Resist strip is a step that removes the developed dry film resist from the panel without affecting the tinplate. The holes covered by the resist are now opened and will not be plated.
Etching is a process in which all copper surfaces are removed rather than covered by tin or patterns.
In the tin stripping step, the tin layer is chemically removed from the panel surface and copper is exposed on the surface. The exposed surface pads, traces, and plate through holes must be clean and free from oxidation.