Requirements for SMD Component Placement
SMD components are frequently used in the PCB manufacturing process. Today, we have concluded 9 requirements for your reference.
1.Fine-pitch devices like BGA, 0.4mm and 0.5mm QFP, etc. are recommended to be placed on the same side.
2.Polar patches are arranged in the same direction as much as possible, and the visual angle required will be less than 60°; as the soldering joints inspection will be affected if higher devices are placed close to lower devices.
3.There must be forbidden zone around the BGA devices.
4.2mm forbidden zone must be left out around QFN/module.
5.Requirements for the distance between SMD: same kind of device: ≥0.5mm; different kinds of device: the distance should meet the requirements of soldering joints inspection, which requires the visual angle ≤60°.
6.The measurement volume of distance value is chosen the larger one from the ponding pad and device itself.
7.When the lower SMD ponding pad is placed closely to the higher device, the distance between them should meet the requirement of soldering joints inspection, which means the visual angle should be less than 60°.
8.The distance between fine-pitch devices and the panel routing edge should be more than 10mm; otherwise it will affect the solder paste print quality.
9.The distance between other non-fine-pitch devices and the panel routing edge should be more than 5mm, and the distance between other non-fine-pitch devices and the non-transmission side panel edge should be more than 3mm.