The Detection of Solder Paste
Automatic inspection system can benefit PCB manufacturers in a variety of ways. In addition to ensuring a high degree of solder joint integrity, it can save PCB cost for manufacturers by detecting defects of PCB board before mass manufacturing. PCB solder paste on the detection and printing of the template are divided into two categories.
The detection of PCB: The detection of the printed area refers to the area of solder paste on each pad. Excessive solder paste may cause bridging phenomena, while too small solder paste can cause weak welding point. The detection of the printing offset is based on whether the number of solder paste on the pad is different from the specified position. The detection of the bridge phenomenon is whether the solder paste applied between the adjacent two pads exceeds a prescribed amount. Excessive solder paste may cause electrical shorts.
The detection of the printing template: It is mainly for the detection of blocking and smearing phenomenon. Detection of blocking refers to detecting the presence of solder paste in the holes in the printing template. If the hole is clogged, the solder paste may appear to be too small at the next printing spot. The detection of tailing means whether or not an excessive amount of solder paste is deposited on the surface of the printing template. These excessive solder paste applied to the circuit board can cause electrical connection problems.