Thick Copper Circuit Board

Dated:2018-01-02      Popularity:2664

Thick Copper Circuit Board

There are various kinds of soldering method of thick copper circuit board, even different copper products have different soldering methods. 

The commonly used four methods are gas soldering, manual carbon arc soldering, manual arc soldering and manual soldering, large structures can also be used automatic soldering. Now take copper and brass as an example, we will give a brief description of the difference between three soldering methods, hoping to help you deepen the understanding of the relevant art of copper.

Gas Soldering
Copper: when soldering copper (commonly known as industrial copper), butt joint is the most commonly used. Gas soldering uses wire, one is a wire containing deoxidizing elements, such as wire 201, 202; the other is a general cut of copper wire and base metal, using gas agent 301 as a flux.
due to the low temperature of the gas-soldering flame, the zinc evaporation in the brass is less than that in the electric soldering, so gas soldering is the most commonly used method in brass soldering. Wires used in brass gas soldering are wire 221, wire 222 and wire 224, etc., these wires contain silicon, tin, iron and other elements which can prevent and reduce the molten pool of zinc evaporation and burning, and help to ensure that the solder performance and prevent producing stoma. 

Carbon Arc Soldering
Copper: carbon arc soldering electrodes used carbon electrode and graphite electrode. Wires used in copper carbon arc soldering are the same with that of gas soldering. Available copper flux is 301 and so on.
Brass: according to the composition of the parent material selection, wire 221, 222, 224 and other wires or brass wire can be used when soldering. 301 can be used as a solvent flux. Soldering should use short arc operation to reduce the zinc evaporation and burning damage.

Manual Arc Soldering
Copper: copper arc soldering use copper electrode 107 copper, soldering core is T2 or T3 copper. The power supply should use reverse DC. Soldering should use a short arc, the electrode should not be horizontal swing. Electrode for reciprocating linear motion can improve the solder formation. Long solder should use gradual retreat soldering method with fast soldering speed. You must completely remove slags between the layers when soldering multi-layer boards. When thickness of boards is greater than 4 mm, the preheated soldering is a must, and the preheat temperature is generally around 400 ~ 500 ℃.
Brass: when soldering brass, except copper 227 and 237, homemade electrodes also can be used. Surface should be carefully cleaned before soldering. Bending angle generally should be more than 60 ~ 70 degrees. To improve the solder formation, products should be preheated to 150 ~ 250 ℃.

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