What Cause Solder Bridges?
Solder bridges or shorts have become more challenging to deal with for those who fabricate or manufacture printed circuit boards. A solder bridge or short occurs when a solder is connecting and crossing one lead to another lead improperly. What makes them difficult to deal with is the fact that they are microscopic, which means that they can’t usually be detected by the naked eye even though one has presented.
There are quite a few different situations that will result in the a short, or solder bridging. Understanding how this can happen can help you avoid some common and unnecessary problem. Causes for solder bridges are listed as follows:
a.The original printed circuit board design has a flaw.
b.Lack of solder resistance between the pads on the printed circuit board.
c.Not applying a sufficient layer of polymer on the copper traces.
d.If the device pitch is less than 0.5 mm the pad to gap ration will cause a short.
e.Incorrect stencil specification will cause too much paste which leads to a solder bridge.
f.Excessive paste or an uneven distribution of it being used.
g.Stencil is too thin or too thick.
h.Mistake on the surface mount component placement.
i.Poor registration of the PCB-solder screen.
Nowadays, our gadgets are becoming smaller and smaller, but the smaller and delicate designs make mistakes more easily to happen which then increases the chances of a solder bridge occurring. Hope this article is useful to you.